We will be exhibiting at
SEMICON TAIWAN 2025

OMRON will be exhibit at SEMICON Taiwan 2025 under the theme.

"Quality paves the way for the future of AI."With "quality" as its core value, OMRON supports the advancement of cutting-edge semiconductor technologies and yield improvement, contributing to the future of AI.

"Can 3D-CT X-ray inspection rapidly visualize semiconductor quality from R&D to mass production?" OMRON answers this question with its proprietary CT-X imaging technology—enabling high-speed inspection of solder joints inside advanced packaging.

In the era of generative AI and ultra-fast data communications, semiconductor quality is critical to enabling digital transformation. OMRON’s 3D-CT X-ray inspection line delivers real-time visualization, quantitative automation, and closed-loop feedback, supporting continuous production of high-quality devices.

Visitors will see some of the real-world defect samples such as Head-In-Pillow (HIP), which is considered one of the most critical failure modes, and micro-voids, alongside inspection use cases like Through Glass Via (TGV) analysis.

The booth will also highlight OMRON’s ongoing collaboration with the Mizuno Laboratory (School of Semiconductor Innovation and Sustainable Manufacturing) at National Cheng Kung University in Taiwan.

This year, OMRON officially established the “Semiconductor & Incubation Center,” a dedicated unit focused on advancing technologies and market expansion in the semiconductor field. At SEMICON Taiwan 2025, OMRON will showcase its latest innovations in high-precision sensing and control. Highlights include the integration of NVIDIA Omniverse with OMRON’s proprietary development platform, Sysmac Studio, enabling a hyper-realistic digital twin that accurately replicates the operation status and inspection results of X-ray systems. The exhibit will also introduce advanced technologies such as high-precision position and force control for W2W/D2W hybrid bonding (reference exhibit), particle monitoring systems for equipment environments, and AI-driven optical inspection solutions capable of detecting defects in glass panels. Through these technological proposals, OMRON reaffirms its commitment to driving innovation in semiconductor manufacturing.

We invite you to visit the OMRON booth and explore our latest innovations for the semiconductor industry.

HIGS（Heterogeneous Integration Global Summit）

Speaker: Mr. Shinji Sugita General Manager, Development Dept., OMRON corporation

Date: September 11 (Thu)

Location: TaiNEX 2, 7th Floor

Topic: 3D X-ray in the Chiplet Era: Automated Inspection for Detecting the Invisible and Improving the Inevitable

Precision Machinery Pavilion

Speaker: Mr. Yuki Tsuchihashi Manager, Development Dept., OMRON corporation

Date: September 12 (Fri)11:40～12:00

Location: TaiNEX 2, 1F，Q5356

Topic: The challenge of visualizing TGV’s quality evidence using 3D X-Ray technology