新時代の検査トレンド！
CT型インラインX線検査装置
VT-Xシリーズ
Introducing the VT-X950
Inspection solutions for 3D packaging for the semiconductor industry
With the practical application of heterogeneous computing＊, chiplet technology is evolving year by year. OMRON's AXI VT-X950 series is used for quality control of the solder mounting process of C4Bump and μBump, which are indispensable for 3D mounting (3D-IC), and for yield improvement by feeding back measurement data.*Heterogeneous computing: Computation on a computer system built with a combination of different types of processors.
Productivity improvement
OMRON's unique high-speed imaging technology and automatic inspection technology achieve stable measurement. Statistical analysis of measured data helps to improve productivity by managing process capability and providing feedback to the manufacturing process.
Versatile applications
Automated inspection of wafers, substrates, JEDEC trays, and other conditions is possible.
By registering the measurement position and inspection position in advance and setting the inspection recipe, it is possible to perform automatic inspection of multiple PCB repeatedly.
Introductory video
High-definition CT images, which are indispensable for void measurement, can be captured and inspected at high speed.
In addition, the measured 3D data can be observed
in any slice and direction.
Automatic inspection of 3D mounted parts is possible.
Even with multiple layers, stable inspection is possible
without the influence of other layers.
It is possible to check the quality of the solder mounting process
of μBump and C4Bump, and to guarantee the inspection
of all products including BGA balls.
