"Quality of Semiconductors" and Omron's Inspection Technology that Support the Evolution of the Digital Society

The Omron Inspection-Systems Division will be exhibited at a SEMICON Japan 2025 where cutting-edge semiconductor-technology gathers. With the theme of "Visualized Quality Fuels a Future with AI." (visualized quality accelerates the future with AI), we propose the junction status of substrates for next-generation AI and high-speed data communication as well as solutions for quality assurance of semiconductors themselves. Our core technology is our unique 3D CT X ray automatic inspection, which we have cultivated over many years, and we support the evaluation of cutting-edge semiconductor-manufacturing technology in the R&D process and automatic inspection in the mass production process.

Proposal of optimal inspection equipment tailored to the customer's manufacturing process phase

How quickly and reliably to guarantee the quality of semiconductors, which are the key to realizing a digital society. Omron will propose inspection systems according to the user phase and purpose.

1. For R&D process/process evaluation/analysis（VT-X950）

VT-X950's proprietary CT-X radiography technology enables the high-speed, high-precision visualization of micro-bumps and TGV inside semiconductors. Through quantitative evaluation and analysis of semiconductor structures and the establishment of quick feedback to other processes in our customers' cutting-edge R&D processes, we strongly support advanced technological development.

2. For mass production and line-stabilization（VT-X750 Series）

VT-X750 offers a combination of high-performance and high-speed testing capabilities that enable inline, full-count testing, and automated testing in the manufacturing process, thereby contributing to stable quality control and efficient conforming product manufacturing.

3. For R&D Process and Process Evaluation/Analysis and Mass Production Trial Production（VP-9000 Series）

Through collaboration with CKD Corporation, we will propose technologies for advanced semiconductors based on the high-precision "visualization" technologies of both companies, from comparing process test data for fine bumps and through collaboration.

In the "Reference Exhibit" section, which we are currently developing technology, we will also introduce "Visualization" of fine defective conditions based on X-ray inspection exposure and appearance and non-appearance inspection with digital twin technology through collaboration with NVIDIA.

By all means, please come to the Omron booth and experience directly the solutions that will support the future of the digitization social.

Speakers

Name: Yuki Tsuchihashi

Affiliation: Inspection Systems Division, X-ray Inspection Systems Department, Development Section

Seminar Title:3D-CT X-Ray Non-Destructive Evaluation for Advanced Package

Outline of seminars: High-speed, high-precision visualization of the inside of advanced packages using a non-destructive testing technique using 3D-CT X wire. This article introduces the latest methods for achieving both reliability improvement and development-efficiency through TGV manufacturing processing issues and sealing and microfluidic structural analysis of fluid-cooled packages.